Heat dissipation utilizing flow of refrigerant

ABSTRACT

A heat pipe heat dissipating device includes a chamber; a rotary shaft positioned within the chamber; an isolating member affixed to the rotary shaft; and a nozzle provided on the isolating member, wherein the nozzle directs the flow of a refrigerant vapor and prompts the rotary shaft and the isolating member to rotate. The heat pipe heat dissipating device can operate with a self-driving operation. A heat pipe heat dissipating method is also provided.

BACKGROUND

With the progress of super-large scale integrated circuit manufacturing technology, the size of a chip is becoming smaller and smaller, while the heat-emitting power is becoming higher and higher, thus increasing the flux of heat dissipation from the chip.

According to the principles of thermodynamics, the heat conductivity of a fluid is larger than that of air. Based on this theory, pipe heat dissipating technologies such as water cooling have been gradually applied to high power electronic components, e.g. CPU and GPU. However, all these heat dissipating technologies have various limitations.

The heat pipe heat exchanger was invented in Los Alamos National Laboratory US in 1964, which promptly transfers the heat of a heat emitting object to the outside though a heat pipe by making full use of the heat conduction principle and the instant heat transfer property of a refrigerating media. The heat conducting ability of the heat pipe heat exchanger surpasses that of any known metal. As a noise-free heat dissipating technology, the heat pipe heat exchanger has been used for heat dissipation of an electronic device from the 1980s, and its application to heat dissipation of a chip has recently increased.

SUMMARY

An example embodiment of the heat dissipating device includes a chamber; a rotary shaft positioned within the chamber; an isolating member affixed to the rotary shaft; and a nozzle provided on the isolating member, wherein the nozzle is configured to direct the flow of a refrigerant vapor and prompts the rotary shaft and the isolating member to rotate.

An alternative example embodiment of the heat dissipating method includes heating a refrigerant within a chamber; generating a refrigerant vapor; and directing the refrigerant vapor through a nozzle positioned on an isolating member, wherein the passing of the refrigerant vapor through the nozzle rotates the isolating member.

The foregoing is a summary and thus contains, by necessity, simplifications, generalization, and omissions of detail; consequently, those skilled in the art will appreciate that the summary is illustrative only and is not intended to be in any way limiting. Other aspects, features, and advantages of the devices and/or processes and/or other subject matter described herein will become apparent in the teachings set forth herein. The summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features of the present disclosure will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. Understanding that these drawings depict only several embodiments in accordance with the disclosure and are, therefore, not to be considered limiting of its scope, the disclosure will be described with additional specificity and detail through use of the accompanying drawings.

FIG. 1 is a schematic sectional front view of one example embodiment of the heat dissipating device according to an example embodiment of the present disclosure;

FIGS. 2 a and 2 b are schematic views of shapes of two example embodiments of the scraping brush, respectively;

FIG. 3 is a schematic principle view of an example embodiment of a heat dissipating device;

FIG. 4 is a schematic sectional top view of another example embodiment of a heat dissipating device;

FIG. 5 is a schematic sectional top view of further another example embodiment of a heat dissipating device;

FIG. 6 is a schematic sectional front view of an example embodiment of a heat dissipating device; and

FIG. 7 is a flowchart of an example embodiment of a heat dissipating method.

DETAILED DESCRIPTION

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here. It will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the Figures, can be arranged, substituted, combined, and designed in a wide variety of different configurations, all of which are explicitly contemplated and make part of this disclosure.

With reference to the accompanying drawings, a detailed description will be given to the structure of example embodiments of a heat dissipating device and a dissipating method for a head pipe, in which a semiconductor chip is taken as an example of a heat emitting object.

The present disclosure is drawn to, inter alia, apparatus, systems and methods of heat dissipation wherein an apparatus includes a chamber; a rotary shaft positioned within the chamber; an isolating member affixed to the rotary shaft; and a nozzle provided on the isolating member, wherein the nozzle directs the flow of a refrigerant vapor and prompts the rotary shaft and the isolating member to rotate.

In an example embodiment, the nozzle is able to eject a refrigerant vapor and thereby drive the evaporation portion scratching brush in rotation through the isolating member, thus realizing the self-driving of the heat pipe heat dissipating device. The fluid refrigerant is uniformly applied to an inner surface of the evaporation portion to form a liquid film so that the heat dissipating ability of the heat pipe heat dissipating device is improved. In addition, the uniform application of the fluid refrigerant to the inner surface of the evaporation portion enhances the heat dissipating uniformity of the heat pipe heat dissipating device

FIG. 1 illustrates a sectional front view of one example embodiment of a heat pipe heat dissipating device of the present disclosure. As shown in FIG. 1, the heat pipe heat dissipating device 100 includes a chamber 101 such as a housing. The chamber 101 is an enclosed or substantially enclosed hollow body which is able to at least isolate the gas transfer between the inside of the chamber 101 and the environment. The exterior of the chamber 101 may be formed in, for example, a column shape, can be a multi-faced cube, for example, a square cube, rectangle, rhomboid, etc. Accordingly, the hollow portion of the chamber 101 may be formed in, for example, a column, can be a multi-faced cube, for example, a square or a rectangle or rhomboid, etc. The chamber 101 may be made of a material with good thermal conductivity properties such as metal.

A refrigerant is contained in the chamber 101. The charging amount of the refrigerant can be determined according to the working temperature and heat dissipating power of the heat pipe heat dissipating device 100, as well as the properties of the refrigerant itself. The refrigerant may be water, ammonia, methanol, etc.

One or more side walls of the chamber 101 may be implemented as an evaporation portion 102. Evaporation portion 102 may be configured to be in contact with the semiconductor chip 120. One or more side walls of the chamber 101 may be implemented as a condensation portion 103. Condensation portion 103 may be configured to be in contact with an auxiliary heat dissipating device (not shown). The heat emitted by the semiconductor chip 120 is transferred to the refrigerant inside the chamber 101 through the evaporation portion 102. The refrigerant evaporates on an inner surface of the evaporation portion 102 and absorbs the heat transferred from the evaporation portion 102. The refrigerant forms a refrigerant vapor after absorbing heat. The refrigerant vapor reaches an inner surface of the condensation portion 103 by dispersion, releases heat to coagulate on the inner surface of the condensation portion 103 and forms a fluid refrigerant. The heat transfer from the evaporation portion to the condensation portion is thereby accomplished. In other example embodiments, an auxiliary heat dissipating device (not shown) such as air cooling, water cooling or fins can be installed to the outer surface of the condensation portion 103 to accelerate the heat transfer from the condensation portion to the outside.

The chamber 101 further includes therein an evaporation portion scraping brush 104 corresponding to the evaporation portion 102. The evaporation portion scraping brush 104 can sweep across the inner surface of the evaporation portion 102. By this sweeping motion, the fluid refrigerant on the evaporation portion scraping brush 104 is uniformly applied to the inner surface of the evaporation portion 102, thus forming a refrigerant liquid film 111 on the inner surface of the evaporation portion 102. Hence, the heat transferred from the semiconductor 120 to the evaporation portion 102 is uniformly absorbed so that the heat dissipating uniformity of the heat pipe heat dissipating device 100 is improved.

The evaporation portion scraping brush 104 can be of an elongated shape, can be a single sector shape as shown in FIG. 2 a, a symmetrical sector shape as shown in FIG. 2 b, etc. The surface of the evaporation portion scraping brush 104 which is opposed to the evaporation portion 102 is in contact with the inner surface of the evaporation portion 102. During the sweeping motion of the evaporation portion scraping brush 104, the surface of the evaporation portion scraping brush 104 is still in contact with the evaporation portion 102. Alternatively, the surface of the evaporation portion scraping brush 104 which is opposed to the evaporation portion 102 is kept a distance from the inner surface of the evaporation portion 102. During the sweeping motion of the evaporation portion scraping brush 104, the surface of the evaporation portion scraping brush 104 is still kept a distance from the evaporation portion 102.

One illustrative reason why a relatively thinner liquid film 111 is formed on the inner surface of the evaporation portion 102 is that the thermal flux of the refrigerant absorbing heat from the surface of the evaporation portion 102 to evaporate is

$\begin{matrix} {q^{''} = \frac{2\; \lambda \; \Delta \; T}{\delta_{0} + \delta^{\prime}}} & (1) \end{matrix}$

Wherein, λ is the heat conductivity of the refrigerant. ΔT is the superheat of the evaporation portion 102 over the environment. As shown in FIG. 3, δ₀ is the initial thickness of the liquid film 111. δ′ is the evaporation final thickness of the liquid film 111, that is, the thickness at which the liquid film 111 does not continue to evaporate at the overheat temperature due to the action forces between molecules. The thickness δ′ is substantially at the order of 10⁻⁹ m. However, to improve the reliability of equation (1), the thickness δ′ can be set at the order of 10⁻⁷ m. From equation (1), δ₀+δ′ represents the heat transfer resistance of the liquid film, in the case that the evaporation final thickness δ′ of the liquid film 111 is constant, the smaller the initial thickness δ₀ of the liquid film 111 is, the higher the heat flux of the refrigerant absorbing heat from the surface of the evaporation portion 102 to evaporate is, i.e. the stronger the heat dissipating ability of the heat pipe heat dissipating device 100 is. When the initial thickness δ₀ of the liquid film 111 is 10 μm and ΔT is 10°, the heat flux q″ can reach 200 W/cm². When the initial thickness δ₀ of the liquid film 111 is 1 μm and ΔT is 10°, the heat flux q″ can reach 800 W/cm². Accordingly, the heat dissipating capability of the heat pipe heat dissipating device 100 can be improved by uniformly applying the fluid refrigerant to the inner surface of the evaporation portion 102 by the evaporation portion scraping brush 104 to form a refrigerant liquid film 111 thereon.

Furthermore, to avoid the situation from occurring that the liquid film 111 cannot take away any more heat from the evaporation portion 102 after reaching the evaporation final thickness δ′ when a period of time has elapsed, the evaporation portion scraping brush 104 can sweep across the inner surface of the evaporation portion 102 periodically to make sure that there is a liquid film 111 that can be evaporated on the inner surface of the evaporation portion 102. The period is determined by the following equation:

$\begin{matrix} {t^{\prime} = \frac{\left( {\delta_{0}^{2} - \delta^{\prime 2}} \right)\rho \; h_{fg}}{2\; \lambda \; \Delta \; T}} & (2) \end{matrix}$

Wherein, t′ is the period, δ₀ is the initial thickness of the liquid film 111, δ₀ is the evaporation final thickness of the liquid film 111, ρ is the density of the refrigerant, h_(fg) is the potential energy of the refrigerant, λ is the heat conductivity of refrigerant, and ΔT is the superheat of the evaporation portion over the environment.

In one example embodiment, the structure as shown in FIGS. 1 and 4 is adopted wherein the evaporation portion scraping brush 104 is configured to sweep across the inner surface of the evaporation portion 102 periodically. Inside the chamber 101, there is further provided a rotary shaft 106 which is perpendicular or substantially perpendicular to the inner surface of the evaporation portion 102. The evaporation portion scraping brush 104 is fixed to an end of the rotary shaft 106 which is adjacent to the evaporation portion 102. The rotary shaft 106 drives the evaporation portion scraping brush 104 to rotate at a given speed such that the evaporation portion scraping brush 104 sweeps across the inner surface of the evaporation portion 102 periodically. In the example embodiment, the chamber 101 can be formed as a column shape with the rotary shaft 106 as a rotation axis. If the inner surface of the evaporation portion 102 is not a plane but a surface of a rotor such as a hemispheric surface, a conical surface or a truncated cone surface, the evaporation portion scraping brush 104 can be formed as an arc shape, a

profile or a

profile, and the rotary shaft 106 is co-linear with the axis of above rotor.

With reference to FIG. 1, to realize a self-driving operation of the rotary shaft 106, the chamber can further comprise therein an isolating member 108 fixed to the rotary shaft 106 and one or more nozzles 109. The inlet of the nozzle 109 is located on the side of the isolating member 108 which faces the evaporation portion 102. The outlet of the nozzle 109 is located on the side of the isolating member 108 which faces the condensation portion 103. The outlet direction of the nozzle 109 is non-uniplanar with the rotary shaft 106. The refrigerant has a tendency of moving towards the condensation portion 103 by the heat expansion and dispersion after absorbing heat to evaporate at the evaporation portion 102. The refrigerant vapor is ejected by the nozzle 109 from the outlet thereof Since the outlet direction of the nozzle 109 is non-uniplanar with the rotary shaft 106, the ejection of refrigerant vapor from the nozzle 109 forms an action force that drives the insolating member 108 to rotate, according to principle of momentum conservation. The isolating member 108 drives the evaporation portion scraping brush 104 to rotate through the rotary shaft 106 so as to periodically sweep across the inner surface of the evaporation portion 102. The self-driving operation of the heat pipe heat dissipating device 100 is thereby realized.

As shown in FIG. 1, the nozzle 109 can be a pipe whose inlet is disposed at a through-hole arranged on the isolating member 108, or an inclined hole disposed on the isolating member 108 with its outlet direction being non-uniplanar with the rotary shaft 106.

The resistance that a section of the scraping brush from the rotary shaft 106 to an end of the evaporation portion scraping brush 104 needs to overcome when rotating is:

$\begin{matrix} {{W_{f} = {N\frac{\mu \; \omega^{2}R^{3}}{3\; \delta_{0}}L}}{or}{W_{f} = {\frac{{\mu \left( {2\; {\pi/t^{\prime}}} \right)}^{2}R^{3}}{3\; \delta_{0}N}L}}} & (3) \end{matrix}$

Wherein, R is the length from the rotary shaft 106 to the end point of the evaporation portion scraping brush 104, and the other variables have the same definitions as those used in equations (1) and (2). Hence, the size and number of the nozzle 109 can be determined according to the above resistance so that the reaction force generated by the gas ejected from the nozzle 109 is able to overcome the above resistance.

In the example embodiment shown in FIG. 4, the rotary shaft 106 is disposed at the center of the evaporation portion scraping brush 104. The same portion of the inner surface the evaporation portion 102 will be swept twice by the evaporation portion scraping brush 104 after one revolution of the rotary shaft 106. Indeed, in other example embodiments, the rotary shaft 106 can be disposed on a side of the evaporation portion scraping brush 104.

The rotational speed of the rotary shaft 106 is determined by the following equation:

$\begin{matrix} {\omega = \frac{4\; \pi \; \lambda \; \Delta \; T}{\left( {\delta_{0}^{2} - \delta^{\prime 2}} \right)\rho \; h_{fg}N}} & (4) \end{matrix}$

wherein, N is the number of times that the same portion of the inner surface of the evaporation portion 102 is swept by the evaporation portion scraping brush 104 after one revolution of the rotary shaft 106, and the other variables have the same definitions as the corresponding variables in equation (1), (2) and (3).

The relationship between the thermal or heat flux of refrigerant absorbing heat from the inner surface of the evaporation portion 102 to evaporate and the rotational speed ω of the rotary shaft 106 is:

$\begin{matrix} {q^{''} = \frac{\left( {\delta_{0} - \delta^{\prime}} \right)\rho \; h_{fg}\omega \; N}{2\; \pi}} & (5) \end{matrix}$

The variables in this equation have the same meanings as the corresponding variables in equation (1), (2), (3) and (4). It is known from equation (4) that the thermal flux of refrigerant absorbing heat from the inner surface of the evaporation portion 102 to evaporate is in direct proportion to the rotary speed ω of the rotary shaft 106. Therefore, the heat dissipating ability of the heat pipe heat dissipating device is controlled by controlling the rotational speed.

In the above example embodiment, there is only one evaporation portion scraping brush 104, but the device is not limited to this. In another example embodiment as shown in FIG. 5, there can be more than one evaporation portion scraping brush 104, and a plurality of evaporation portion scraping brushes 104 can be arranged equiangularly with the rotary shaft 106 as a center. In this case, the number of times that the same location of the inner surface of the evaporation portion 102 is swept by the evaporation portion scraping brush 104 after one revolution of the rotary shaft 106 is in direct proportion to the number of the evaporation portion scraping brushes 104.

In still another example embodiment, the rotary shaft 106 is disposed between the center of the evaporation portion scraping brush 104 and the edge of the same, that is, the distance from one end of the evaporation portion scraping brush 104 to the rotary shaft 106 is smaller than that from the other end to the rotary shaft 106. Such a structure enables the circular region which centers on the rotary shaft 106 and has a radius of the distance from the rotary shaft 106 to the nearest end of the evaporation portion scraping brush 104 to be swept twice by the evaporation portion scraping brush 104 after one revolution of the rotary shaft 106, while the remaining region will be swept only once by the evaporation portion scraping brush 104. When the central portion of the semiconductor 120 emits a higher amount of heat than the edge, the above structure can be adopted to strengthen the heat dissipation of the center of the semiconductor 120.

As shown in FIG. 6, the chamber 101 can further include therein a condensation portion scraping brush 105. The condensation portion scraping brush 105 sweeps across the inner surface of the condensation portion 103 periodically. Under this sweeping motion, the condensation portion scraping brush 105 continuously collects the coagulated fluid refrigerant droplets 112 from the inner surface of the condensation portion 103. The refrigerant fluid droplets 112 are thus prevented from falling onto the inner surface of the evaporation portion 102 randomly after having accumulated to a sufficient weight to fluctuate the heat dissipating performance of the heat pipe heat dissipating device 100.

The condensation portion scraping brush 105 can be of elongated profile, can be a single sector shape shown in FIG. 2 a, a symmetrical sector shape shown in FIG. 2 b, etc. The surface of the condensation portion scraping brush 105 which is opposed to the condensation portion 103 is in contact with the inner surface of the condensation portion 103. During the sweeping motion of the condensation portion scraping brush 105, the surface of the condensation portion scraping brush 105 is still in contact with the evaporation portion 102. Alternatively, the surface of the condensation portion scraping brush 105 which is opposed to the condensation portion 103 is kept a distance from the inner surface of the condensation portion 103. During the sweeping motion of the condensation portion scraping brush 105, the surface of the condensation portion scraping brush 105 is still kept a distance from the evaporation portion 102.

In one example embodiment, the method can be adopted wherein just as the condensation portion scraping brush 105 sweeps across the inner surface of the condensation portion 103 periodically. The evaporation portion scraping brush 104 may sweep across the evaporation portion 102. When the evaporation portion scraping brush 104 moves in a rotary manner as shown in FIG. 4, the condensation portion scraping brush 105 can also be mounted to the rotary shaft 106. The rotary shaft 106 drives the evaporation portion scraping brush 104 and the condensation portion scraping brush 105 to rotate together. In another example embodiment, there can be one condensation portion scraping brush 105, or a plurality of condensation portion scraping brushes 105 which are arranged equiangularly centering on the rotary shaft 106.

The condensation portion scraping brush 105 and the evaporation portion scraping brush 104 can be made both from a porous material to enhance the fluid storing ability of the two scraping brushes, and to further improve the ability of the condensation portion scraping brush 105 to collect fluid refrigerant droplets 112 and the ability of the evaporation portion scraping brush 104 to apply refrigerant liquid film 111.

With reference to FIG. 6, the chamber 101 can include therein a fluid conducting bridge 107 made from a porous material. The fluid conducting bridge 107 connects the condensation portion scraping brush 105 with the evaporation portion scraping brush 104. Since the fluid conducting bridge 107 is made from a porous material, a number of capillary tube passages are formed inside the fluid conducting bridge 107. The fluid refrigerant collected by the condensation portion scraping brush 105 can arrive the evaporation portion scraping brush 104 through the capillary tube passages inside the fluid conducting bridge 107 to form a refrigerant capillary tube path from the condensation portion scraping brush 105 to the evaporation portion scraping brush 104, thus realizing the cyclic use of refrigerant and enabling the heat pipe heat dissipating device 100 to work continuously.

In one example embodiment, the projection on the inner surface of the evaporation portion 102 of the contact area between the semiconductor chip 120 and the outer surface of the evaporation portion 102 is the same as the inner surface region of the evaporation portion 102 swept by the evaporation portion scraping brush 104, or within the inner surface region. Local overheating of the semiconductor chip 120 is thereby avoided.

In the heat pipe heat dissipating device discussed herein, the refrigerant liquid film 111 is adsorbed to the inner surface of the evaporation portion 102 by the attractions between molecules. The refrigerant vapor arrives the inner surface of the condensation portion 103 by heat expansion and dispersion to coagulate. The fluid refrigerant arrives the evaporation portion scraping brush 104 from the condensation portion scraping brush 105 through the fluid conducting bridge 107 under capillary action. The above steps form the cycle of refrigerant. Hence, no gravity is involved during the operation of the heat pipe heat dissipating device 100. Thus, the heat pipe heat dissipating device and the heat pipe heat dissipating method can be applied to a non-gravity environment, for example, a vacuum. In the case that the capillary tube passages inside the fluid conducting bridge 107 are small enough, the heat pipe heat dissipating device 100 can be used where the device is positioned in an upright position, a side position and an inverted position.

The flowchart of an example embodiment of the heat pipe heat dissipating method is shown in FIG. 7. The method includes, in step S201, a refrigerant forms a refrigerant vapor. In step S202, the refrigerant vapor is ejected from a nozzle on an isolating member to drive an evaporation portion scraping brush to rotate and to form a refrigerant liquid film on an inner surface of the evaporation portion.

In step S203, the refrigerant vapor is dispersed through the nozzle to a condensation portion of the heat pipe heat dissipating device. In step S204, the refrigerant vapor forms a fluid refrigerant on an inner surface of the condensation portion. In step S205, a condensation portion scraping brush sweeps across the inner surface of the condensation portion to collect the fluid refrigerant on the inner surface of the condensation portion. In step S206, the fluid refrigerant reaches the evaporation portion scraping brush through a capillary tube path inside a fluid conducting bridge made from a porous material to form the cycle of refrigerant.

The ejecting direction of the nozzle applied to the above example embodiment is non-uniplanar with the rotary shaft of the evaporation portion scraping brush.

In one example embodiment, the formation of the refrigerant liquid film is realized by the evaporation portion scraping brush sweeping across the inner surface of the evaporation portion.

In another example embodiment, the motion of the evaporation portion scraping brush sweeping across the inner surface of the evaporation portion is periodic.

The motion of the evaporation portion scraping brush sweeping across the inner surface of the evaporation portion is periodic. In one example embodiment, the isolating member drives the evaporation portion scraping brush to rotate at a given speed through the rotary shaft.

The angular speed of the rotary shaft is determined by equation (4).

In addition, the heat pipe heat dissipating method may further include the condensation portion scraping brush sweeping across the inner surface of the condensation portion to collect the fluid refrigerant on the inner surface of the condensation portion. In other example embodiments, sweeping across the inner surface of condensation portion by the condensation portion scraping brush is realized by the isolating member driving the evaporation portion scraping brush and the condensation portion scraping brush to rotate at a given speed through the rotary shaft. Also, the rotational angular speed of the rotary shaft can be determined by equation (4).

In still another example embodiment, the fluid refrigerant reaches the evaporation portion scraping brush through a capillary tube path inside a fluid conducting bridge made from a porous material to form the cycle of refrigerant.

With respect to the use of substantially any plural and/or singular terms herein, those having skill in the art can translate from the plural to the singular and/or from the singular to the plural as is appropriate to the context and/or application. The various singular/plural permutations may be expressly set forth herein for sake of clarity.

It will be understood by those within the art that, in general, terms used herein, and especially in the appended claims (e.g., bodies of the appended claims) are generally intended as “open” terms (e.g., the term “including” should be interpreted as “including but not limited to,” the term “having” should be interpreted as “having at least,” the term “includes” should be interpreted as “includes but is not limited to,” etc.). It will be further understood by those within the art that if a specific number of an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding, the following appended claims may contain usage of the introductory phrases “at least one” and “one or more” to introduce claim recitations. However, the use of such phrases should not be construed to imply that the introduction of a claim recitation by the indefinite articles “a” or “an” limits any particular claim containing such introduced claim recitation to disclosures containing only one such recitation, even when the same claim includes the introductory phrases “one or more” or “at least one” and indefinite articles such as “a” or “an” (e.g., “a” and/or “an” should typically be interpreted to mean “at least one” or “one or more”); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation of “two recitations,” without other modifiers, typically means at least two recitations, or two or more recitations). In those instances where a convention analogous to “at least one of A, B, or C, etc.” is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., “a system having at least one of A, B, or C” would include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and/or A, B, and C together, etc.). It will be further understood by those within the art that virtually any disjunctive word and/or phrase presenting two or more alternative terms, whether in the description, claims, or drawings, should be understood to contemplate the possibilities of including one of the terms, either of the terms, or both terms. For example, the phrase “A or B” will be understood to include the possibilities of “A” or “B” or “A and B.”

While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims. 

1. A heat dissipating device, comprising: a chamber; a rotary shaft positioned within the chamber; an isolating member affixed to the rotary shaft; and a nozzle provided on the isolating member, wherein the nozzle is configured to direct the flow of a refrigerant vapor and prompts the rotary shaft and the isolating member to rotate.
 2. The heat dissipating device according to claim 1, wherein, the nozzle is a through-hole arranged on the isolating member.
 3. The heat dissipating device according to claim 1, wherein the chamber comprises a refrigerant.
 4. The heat dissipating device according to claim 1, further comprising: a first scrapping brush affixed to one end of the rotary shaft.
 5. The heat dissipating device according to claim 4, further comprising: a second scraping brush affixed to the other end of the rotary shaft.
 6. The heat dissipating device according to claim 5, wherein the heat dissipating device further comprises: a fluid conducting bridge connecting said two scraping brushes.
 7. The heat dissipating device according to claim 4, further comprising: a plurality of scraping brushes, wherein and the plurality of scraping brushes are arranged equiangularly with the rotary shaft as a center.
 8. A heat dissipating method, comprising: heating a refrigerant within a chamber; generating a refrigerant vapor; and directing the refrigerant vapor through a nozzle positioned on an isolating member, wherein the passing of the refrigerant vapor through the nozzle rotates the isolating member.
 9. The heat dissipating method according to claim 8, wherein, the nozzle is a through-hole arranged on the isolating member.
 10. The heat dissipating method according to claim 8, wherein the isolating member is positioned on a rotary shaft.
 11. The heat dissipating method according to claim 10, wherein a first scrapping brush is affixed to one end of the rotary shaft.
 12. The heat dissipating method according to claim 11, wherein said first scraping brush sweeps periodically.
 13. The heat dissipating method according to claim 11, further comprising: a second scraping brush affixed to the other end of the rotary shaft.
 14. The heat dissipating method according to claim 10, wherein the ejection direction of the nozzle is non-uniplanar with the rotary shaft.
 15. The heat dissipating method according to claim 13, further comprising: a fluid conducting bridge connecting said two scraping brushes. 